Dimension : 2887(L) x 2300(W) x 2175(H) mm
Panel :
- Meterial : Etching PCB
- Input Substrate temperature : Below 40°C
- Size Max : 542.0(W) x 620.0(L)mm / Min : 500(W)ｘ600(L)mm
- Thickness : 0.05mm ~1.0 mm
- Weight : Less than 2.5kg
- Warpage : 0.05% or less of the substrate's diagonal dimension
Fiim :
- Type : Roll type 3inch bobbin
- Thickness : PET 38um, Adhesive 15um
- Width : 490mm~542mm
- DIA : Less than Max. 200 Ø
- Adhesive power : Less than 100g/㎠±50
Hot roll :
- Pressurization system : organic connection between upper and lower units
- Speed : 56.0m/min
- Dimension : Ø70
- Temperature deviation : ±1°C
- Coated material Silicon : Silicon 70° / 3T
- Heater : Cartridge Heater 1.5kw
Precision Productivity :
- Front / Rear : Repeated lamination accuracy: ±1.0 mm
- Cycle time : 30pcs/hour
System :
- Control : PLC Control
- Barcode scan : Scanner installation:
- Consultation with manufacturer on location of installation
- Temp control : PID Control & ON/OFF type
- Interface : Further discussion
- Operation control : Touch Monitor
- Air Port : 7 Bar & Ø12 8ea + 1ea(spare)
- Electrics : AC220v , 50~60Hz , 3Phase
- SECS GEM
